WaferLevelPackage(WLP) connector, also known as Wafer LevelChippackage (WLCSP) connector, is an advanced integrated circuit packaging technology, which is directly used for silicon wafers. (wafer) hierarchical encapsulation. This technology is different from the traditional single chip packaging method. It allows the chip package to be completed at the end of the wafer manufacturing process, instead of packaging after cutting the wafer into individual chips.

Features of WLCSP include:

Small size and light weight: Because the package is directly completed on the wafer, the size of the final product is very close to that of the bare chip, making the final package very small and light.

High performance: WLCSP can provide better electrical performance, especially in high-frequency applications, because it reduces additional packaging materials and steps.

Thermal management: This packaging method helps to dissipate heat more effectively.

Cost-effectiveness: WLCSP can reduce the overall manufacturing cost because it saves the packaging process of a single chip.

Widely used: This technology is widely used in small high-performance electronic products, such as smart phones, tablet computers, wearable devices and so on.

However, WLCSP also has some challenges, such as higher precision requirements for wafer cutting and chip assembly, and special requirements for packaging materials. Nevertheless, due to its size and performance advantages, WLCSP is still an increasingly popular choice for high-end electronic devices.